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APT50M75JFLL 500V 51A S G D 0.075 S POWER MOS 7 (R) R FREDFET Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching (R) losses are addressed with Power MOS 7 by significantly lowering RDS(ON) (R) and Qg. Power MOS 7 combines lower conduction and switching losses along with exceptionally fast switching speeds inherent with APT's patented metal gate structure. * Lower Input Capacitance * Lower Miller Capacitance * Lower Gate Charge, Qg MAXIMUM RATINGS Symbol VDSS ID IDM VGS VGSM PD TJ,TSTG TL IAR EAR EAS Parameter Drain-Source Voltage Continuous Drain Current @ TC = 25C Pulsed Drain Current 1 SO 2 T- 27 "UL Recognized" ISOTOP (R) * Increased Power Dissipation * Easier To Drive * Popular SOT-227 Package * FAST RECOVERY BODY DIODE D G S All Ratings: TC = 25C unless otherwise specified. APT50M75JFLL UNIT Volts Amps 500 51 204 30 40 460 3.68 -55 to 150 300 51 50 4 Gate-Source Voltage Continuous Gate-Source Voltage Transient Total Power Dissipation @ TC = 25C Linear Derating Factor Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec. Avalanche Current 1 Volts Watts W/C C Amps mJ (Repetitive and Non-Repetitive) 1 Repetitive Avalanche Energy Single Pulse Avalanche Energy 2500 STATIC ELECTRICAL CHARACTERISTICS Symbol BVDSS RDS(on) IDSS IGSS VGS(th) Characteristic / Test Conditions Drain-Source Breakdown Voltage (VGS = 0V, ID = 250A) Drain-Source On-State Resistance 2 MIN TYP MAX UNIT Volts 500 0.075 250 1000 100 3 5 (VGS = 10V, ID = 25.5A) Ohms A nA Volts 9-2004 050-7034 Rev D Zero Gate Voltage Drain Current (VDS = 500V, VGS = 0V) Zero Gate Voltage Drain Current (VDS = 400V, VGS = 0V, TC = 125C) Gate-Source Leakage Current (VGS = 30V, VDS = 0V) Gate Threshold Voltage (VDS = VGS, ID = 2.5mA) CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com DYNAMIC CHARACTERISTICS Symbol Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf Eon Eoff Eon Eoff Symbol IS ISM VSD dv/ dt APT50M75JFLL Test Conditions VGS = 0V VDS = 25V f = 1 MHz VGS = 10V VDD = 300V ID = 51A @ 25C RESISTIVE SWITCHING VGS = 15V VDD = 300V ID = 51A @ 25C 6 INDUCTIVE SWITCHING @ 25C VDD = 333V, VGS = 15V INDUCTIVE SWITCHING @ 125C VDD = 333V VGS = 15V ID = 51A, RG = 5 ID = 51A, RG = 5 RG = 0.6 Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge 3 MIN TYP MAX UNIT pF 5590 1180 85 125 33 65 8 17 21 3 675 650 1110 755 MIN TYP MAX Gate-Source Charge Gate-Drain ("Miller ") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy Characteristic / Test Conditions Continuous Source Current (Body Diode) Pulsed Source Current Diode Forward Voltage Peak Diode Recovery 1 2 dt 6 nC ns J SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS UNIT Amps Volts V/ns ns C Amps 51 228 1.3 15 Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C MIN (Body Diode) (VGS = 0V, IS = -51A) 5 dv/ t rr Q rr IRRM Reverse Recovery Time (IS = -51A, di/dt = 100A/s) Reverse Recovery Charge (IS = -51A, di/dt = 100A/s) Peak Recovery Current (IS = -51A, di/dt = 100A/s) Characteristic Junction to Case Junction to Ambient 280 600 1.9 5.7 15 23 TYP MAX THERMAL CHARACTERISTICS Symbol RJC RJA UNIT C/W 0.27 40 1 Repetitive Rating: Pulse width limited by maximum junction temperature 2 Pulse Test: Pulse width < 380 s, Duty Cycle < 2% 3 See MIL-STD-750 Method 3471 0.30 , THERMAL IMPEDANCE (C/W) 4 Starting Tj = +25C, L = 1.92mH, RG = 25, Peak IL = 51A 5 dv/dt numbers reflect the limitations of the test circuit rather than the device itself. IS -ID51A di/dt 700A/s VR VDSS TJ 150C 6 Eon includes diode reverse recovery. See figures 18, 20. APT Reserves the right to change, without notice, the specifications and information contained herein. 0.25 0.20 0.9 0.7 0.15 0.5 Note: PDM 9-2004 0.10 0.3 t1 t2 050-7034 Rev D JC Z 0.05 0 0.1 0.05 10-5 10-4 SINGLE PULSE 10-3 10-2 10-1 RECTANGULAR PULSE DURATION (SECONDS) FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION Duty Factor D = t1/t2 Peak TJ = PDM x ZJC + TC 1.0 Typical Performance Curves Junction temp. (C) RC MODEL 120 100 80 60 40 APT50M75JFLL 15 &10V 8V 7.5V ID, DRAIN CURRENT (AMPERES) 0.0409 0.0246F 7V Power (watts) 0.255 0.406F 6.5V 0.00361 Case temperature. (C) 148F 6V 20 5.5V 0 5 10 15 20 25 30 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS 1.2 V GS 0 140 ID, DRAIN CURRENT (AMPERES) VDS> ID (ON) x RDS(ON) MAX. 250SEC. PULSE TEST @ <0.5 % DUTY CYCLE RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL 160 NORMALIZED TO = 10V @ I = 25.5A D 120 100 80 60 40 20 0 TJ = +125C TJ = +25C TJ = -55C 1.1 VGS=10V 1.0 VGS=20V 0.9 012 34567 8 9 10 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) FIGURE 4, TRANSFER CHARACTERISTICS 0.8 0 60 BVDSS, DRAIN-TO-SOURCE BREAKDOWN VOLTAGE (NORMALIZED) 1.15 1.10 1.05 1.00 0.95 0.90 0.85 -50 20 40 60 80 100 ID, DRAIN CURRENT (AMPERES) FIGURE 5, RDS(ON) vs DRAIN CURRENT ID, DRAIN CURRENT (AMPERES) 50 40 30 20 10 0 25 RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE (NORMALIZED) 50 75 100 125 150 TC, CASE TEMPERATURE (C) FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE 2.5 I D = 25.5A -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (C) FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 V GS = 10V 2.0 1.5 1.0 VGS(TH), THRESHOLD VOLTAGE (NORMALIZED) 0.5 0.0 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (C) FIGURE 8, RDS(ON) vs. TEMPERATURE 0 25 50 75 100 125 150 TC, CASE TEMPERATURE (C) FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE -25 050-7034 Rev D 9-2004 204 100 OPERATION HERE LIMITED BY RDS (ON) 20,000 10,000 100S C, CAPACITANCE (pF) APT50M75JFLL Ciss ID, DRAIN CURRENT (AMPERES) 1,000 Coss 10 1mS 10mS TC =+25C TJ =+150C SINGLE PULSE 100 Crss IDR, REVERSE DRAIN CURRENT (AMPERES) VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) 1 10 100 500 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 10, MAXIMUM SAFE OPERATING AREA 16 I = 51A VDS=100V D VDS=250V 12 VDS=400V 8 1 0 10 20 30 40 50 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 11,CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE 200 100 10 TJ =+150C TJ =+25C 10 4 40 80 120 160 200 Qg, TOTAL GATE CHARGE (nC) FIGURE 12, GATE CHARGE vs GATE-TO-SOURCE VOLTAGE 100 90 80 td(on) and td(off) (ns) 0 0 1 0.3 0.6 0.9 1.2 1.5 VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS) FIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE 120 110 V DD G = 333V R = 5 td(off) V DD G 100 90 80 tr and tf (ns) T = 125C J L = 100H 70 60 50 40 30 20 10 = 333V tf R = 5 T = 125C J 70 60 50 40 30 20 10 tr L = 100H td(on) 1 10 50 60 70 80 90 ID (A) FIGURE 14, DELAY TIMES vs CURRENT V DD G 20 30 40 50 60 70 80 90 ID (A) FIGURE 15, RISE AND FALL TIMES vs CURRENT 3000 2500 SWITCHING ENERGY (J) V I DD 10 20 30 40 2500 = 333V = 333V R = 5 D J = 51A SWITCHING ENERGY (J) 2000 T = 125C J T = 125C L = 100H E ON includes diode reverse recovery L = 100H EON includes diode reverse recovery Eon Eoff 2000 1500 1000 500 0 1500 1000 Eon 9-2004 500 050-7034 Rev D Eoff 50 60 70 80 90 ID (A) FIGURE 16, SWITCHING ENERGY vs CURRENT 0 10 20 30 40 10 15 20 25 30 35 40 45 50 RG, GATE RESISTANCE (Ohms) FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE 0 5 APT50M75JFLL 90 % Gate Voltage 10 % t d(on) T J = 125 C Drain Current 90% tr 5% 10% Switching Energy 5% Drain Voltage Gate Voltage t d(off) tf 90% Drain Voltage TJ = 125 C 0 10% Drain Current Switching Energy Figure 18, Turn-on Switching Waveforms and Definitions Figure 19, Turn-off Switching Waveforms and Definitions APT60DF60 V DD ID V DS G D.U.T. Figure 20, Inductive Switching Test Circuit SOT-227 (ISOTOP(R)) Package Outline 31.5 (1.240) 31.7 (1.248) 7.8 (.307) 8.2 (.322) W=4.1 (.161) W=4.3 (.169) H=4.8 (.187) H=4.9 (.193) (4 places) 11.8 (.463) 12.2 (.480) 8.9 (.350) 9.6 (.378) Hex Nut M4 (4 places) r = 4.0 (.157) (2 places) 4.0 (.157) 4.2 (.165) (2 places) 25.2 (0.992) 0.75 (.030) 12.6 (.496) 25.4 (1.000) 0.85 (.033) 12.8 (.504) 14.9 (.587) 15.1 (.594) 30.1 (1.185) 30.3 (1.193) 38.0 (1.496) 38.2 (1.504) * Source Drain * Source terminals are shorted internally. Current handling capability is equal for either Source terminal. * Source Dimensions in Millimeters and (Inches) ISOTOP(R) is a Registered Trademark of SGS Thomson. Gate APT's products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved. 050-7034 Rev D 9-2004 3.3 (.129) 3.6 (.143) 1.95 (.077) 2.14 (.084) |
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